High performance probe system

ABSTRACT

A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC&#39;s I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC&#39;s pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC&#39;s pads.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a system for providing paths suitable for highfrequency signals passing between an integrated circuit (IC) testequipment and pads on the surfaces of ICs to be tested.

2. Description of Related Art

Integrated circuits (ICs) are often tested while still in the form ofdie on a semiconductor wafer. The following U.S. patents describeexemplary probe board assemblies for providing signal paths between anintegrated circuit tester and input/output (I/O), power and ground padson the surfaces of ICs formed on a semiconductor wafer: U.S. Pat. No.5,974,662 issued Nov. 2, 1999 to Eldridge et al, U.S. Pat. No. 6,064,213issued May 16, 2000 to Khandros, et al and U.S. Pat. No. 6,218,910issued Apr. 17, 2001 to Miller.

FIG. 1 is a plan view and FIG. 2 is a sectional elevation view of anexemplary prior art probe board assembly 10 for providing signal pathsbetween an integrated circuit tester 12 and ICs 14 formed on asemiconductor wafer 16. Tester 12 implements one or more testerchannels, each providing a test signal as input to one of ICs 14 orreceiving and processing an IC output signal to determine whether the ICoutput signal is behaving as expected. Probe card assembly 10 includes aset of pogo pin connectors 26 and a set of three interconnectedsubstrate layers including an interface board 20, an interposer 22 and aspace transformer 24. Pogo pins 28 provide signal paths between tester12 and contact pads 30 on the upper surface of interface board 20.Interface board 20 is typically a multiple layer printed circuit boardincluding microstrip and stripline traces for conveying signalshorizontally and vias for conveying signals vertically between pads 30on its planar upper surface and a set of contact pads 32 on its planarlower surface.

Interposer 22 includes one set of spring contacts 34 mounted on itsupper surface and a corresponding set of spring contacts 36 mounted onits lower surface. Each spring contact 34 contacts a separate one of thepads 32 on the lower surface of interface board 20, and each springcontact 36 contacts one of a set of pads 38 on the upper surface ofspace transformer 24. Vias passing through interposer 22 provide signalpaths between corresponding pairs of spring contacts 34 and 36.

Space transformer 24 provides signal paths linking spring contacts 36 toa set of probes 40 arranged to contact I/O, power and ground pads 44 onthe surfaces of a set of ICs 14 to be tested. A chuck 42 positions wafer16 with probes 40 in alignment with IC pads 44 of the ICs 14 to betested. After one group of ICs 14 have been tested, chuck 42 repositionswafer 16 so that probes 40 access the IC pads 44 of a next group of ICsto be tested.

Various types of structures can be used to implement probes 40including, for example, wire bond and lithographic spring contacts,needle probes, and cobra probes. In some probe systems, probes 40 areimplemented as spring contacts formed on the lower surface of spacetransformer 24 with their tips extending downward to contact IC pads 44on the surfaces of ICs 14. Alternatively, spring contact type probes 40are attached to the IC's pads 44 with their tips extending upward tocontact pads on the lower surface of space transformer 24.

A test signal generated by a tester channel implemented within one ofcircuit boards 18 travels through a pogo pin 28 to one of pads 30 on thesurface of interface board 20, and then travels through traces and viaswithin interface board 20 to one of pads 32 on its lower surface. Thetest signal then passes through one of spring contacts 34, through a viawithin interposer 22, and through one of spring contacts 36 to one ofcontacts 38 on the surface of space transformer 24. Traces and viaswithin space transformer 24 then deliver the test signal to a probe 40which then conveys the test signal to an IC pad 44 on the surface of oneof ICs 14. An IC output signal produced at one of IC pads 44 follows asimilar path in an opposite direction to reach a channel within one ofcircuit boards 18. As described in detail in the aforementioned U.S.Pat. No. 5,974,662, interposer 22, with its flexible spring contacts 34and 36, provides compliant electrical connections between interfaceboard 20 and space transformer 24. Probes 40 may be made sufficientlyresilient to compensate for any variation in elevation of the IC pads 44on the upper surfaces of ICs 14.

FIG. 2 has an expanded vertical scale to more clearly show the variouscomponents of probe board assembly 10. The horizontal area over whichpogo pins 28 are actually distributed is typically many times largerthan the area over which probes 40 are distributed. Probe card assembly10 is well adapted for connecting I/O ports of tester channels that aredistributed over a relatively wide horizontal area to a set of probes 40that are aligned to access IC pads 44 that are densely packed into arelatively small horizontal area.

One problem probe board assembly 10 shares to some degree with anyinterconnect system, is that the signal paths it provides tend todistort and attenuate signals, particularly signals having highfrequency components. What is needed is a probe board assembly forproviding signal paths between an IC tester and pads on one or more ICs,wherein at least some of the IC pads transmit and receive high frequencysignals.

BRIEF SUMMARY OF THE INVENTION

A system for providing signal paths between an integrated circuit (IC)tester and input/output (I/O), power and ground pads of ICs to be testedincludes a probe board assembly, a flex cable and a set of probesarranged to contact the IC's pads. The probe board assembly includes oneor more substrate layers (which may be rigid) and signal paths throughthe substrate layer(s) for linking the tester to one set of the probes.The flex cable includes a flexible substrate structurally linked to alayer of the probe board assembly and a set of signal paths through theflexible substrate for linking the tester to another set of the probes.

The claims appended to this specification particularly point out anddistinctly claim the subject matter of the invention. However thoseskilled in the art will best understand both the organization and methodof operation of what the applicant(s) consider to be the best mode(s) ofpracticing the invention, together with further advantages and objectsof the invention, by reading the remaining portions of the specificationin view of the accompanying drawing(s) wherein like reference charactersrefer to like elements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a prior art probe board assembly for providingsignal paths between an integrated circuit (IC) tester and input/output,power and ground pads on an array of ICs,

FIG. 2 is a sectional elevation view of the prior art probe boardassembly of FIG. 1,

FIG. 3 is a plan view of a probe system in accordance with an exemplaryembodiment of the invention for providing signal paths between an ICtester and pads on one or more ICs,

FIGS. 4 and 5 are sectional elevation views the probe system of FIG. 3,

FIG. 6 is a plan view of the flex cable termination block of FIG. 5,

FIG. 7 is a plan view of the lower surface of the space transformer ofthe probe system of FIG. 3,

FIG. 8 is a sectional elevation view of a probe system in accordancewith a second exemplary embodiment of the invention for providing signalpaths between an IC tester and pads on one or more ICs,

FIG. 9 is an expanded partial sectional elevation view of the probesystem of FIG. 8,

FIG. 10 is a plan view of the lower surface of the space transformer ofthe probe system of FIG. 8,

FIG. 11 is a plan view of the lower surface of a space transformer of athird exemplary embodiment of the invention for providing signal pathsbetween an IC tester and pads on one or more ICs,

FIG. 12 is an expanded partial sectional elevation view of the probesystem of FIG. 11,

FIG. 13 is a sectional elevation view of a probe system in accordancewith a fourth exemplary embodiment of the invention for providing signalpaths between an IC tester and pads on one or more ICs,

FIG. 14 is a sectional elevation view of a probe system in accordancewith a fifth exemplary embodiment of the invention for providing signalpaths between an IC tester and IC pads on one or more ICs,

FIG. 15 is an expanded partial sectional elevation view of the probesystem of FIG. 14,

FIG. 16 is a plan view of the lower surface of the space transformer andthe flex cables of the probe system of FIG. 14, and

FIG. 17 is an expanded plan view of an area of flex cable of FIG. 16containing a single substrate island,

FIG. 18 is a sectional elevation view of a probe system in accordancewith a sixth exemplary embodiment of the invention for providing signalpaths between an IC tester and spring contacts formed on pads on one ormore ICs,

FIG. 19 is an expanded partial sectional elevation view of the probesystem of FIG. 17,

FIG. 20 is a plan view of the lower surface of the space transformer andthe flex cables of the probe system of FIG. 17,

FIG. 21 is an expanded plan view of an area of flex cable of FIG. 20containing a single substrate island,

FIG. 22A is a side elevation view of a probe system in accordance with aseventh exemplary embodiment of the invention for providing signal pathsbetween an IC tester, remote test equipment and pads on one or more ICs,

FIG. 22B is a block diagram illustrating signal paths within the flexcable of FIG. 22A,

FIG. 23A is a plan view of a probe system in accordance with an eighthexemplary embodiment of the invention,

FIG. 23B is a side elevation view of the probe system of FIG. 23A, and

FIGS. 24A-24G illustrate steps in an exemplary embodiment of a processfor forming probe tips on a flex cable in accordance with the invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION

The present invention is directed to a probe board assembly forproviding signal paths between an integrated circuit (IC) tester andinput/output (I/O), power and ground pads of one or more ICs to betested either while the ICs are still in the form of die on asemiconductor wafer or after they have been separated from one another.The specification describes exemplary embodiments and applications ofthe invention considered by the applicant(s) to be the best modes ofpracticing the invention. It is not intended, however, that theinvention be limited to the exemplary embodiments described below or tothe particular manner in which the embodiments operate.

FIG. 3 is a plan view and FIGS. 4 and 5 are sectional elevation views ofa probe system 50 in accordance with an exemplary embodiment of theinvention for providing signal paths between an IC tester 52 to I/O,power and ground pads 54 on the surfaces of ICs 56, for example, whilestill in the form of die on a semiconductor wafer 58. Verticaldimensions in FIGS. 4 and 5 are exaggerated so that the individualcomponents forming probe system 50 may be more easily distinguished.

Probe system 50 includes a probe board assembly 51 having multipleinterconnected substrate layers, including an interface board 60, aninterposer 62 and a space transformer 64. Pogo pin connectors 66 withinIC tester 52 include a set of pogo pins 68 providing signal pathsbetween the tester 52 and contact pads 70 residing in on the uppersurface of interface board 60. Interface board 60 preferably, though notexclusively, comprises one or more layers of rigid insulating substratematerial upon which are formed microstrip and/or stripline traces forconveying signals horizontally and through which are provided vias forconveying signals vertically between the pads 70 on its upper surfaceand a set of contact pads 72 on its lower surface.

Interposer 62 preferably, though not exclusively, includes a rigidinsulating substrate having a set of flexible spring contacts 74 mountedon its upper surface and a corresponding set of flexible spring contacts76 mounted on its lower surface. Each spring contact 74 contacts aseparate one of the pads 72 on the lower surface of interface board 60,and each spring contact 76 contacts one of a set of pads 78 on the uppersurface of space transformer 64. A set of conductive vias passing thoughinterposer 62 provide signal paths between corresponding pairs of springcontacts 74 and 76.

Space transformer 64 provides signal paths linking the pads 78 on itsupper surface to a set of probes 80 arranged to contact IC pads 54 onthe surfaces of a set of ICs 56 to be tested. Wafer 58 resides on achuck 82 for positioning wafer 58 so that probes 80 contact the pads 54of the ICs 56 to be tested. After one group of ICs 56 have been tested,chuck 82 repositions wafer 56 so that probes 80 access the pads 54 of anext group of ICs 56 to be tested.

As described in more detail in the aforementioned U.S. Pat. No.5,974,662, interposer 62, with its flexible spring contacts 74, 76,provides compliant electrical connections between interface board 60 andspace transformer 64. Probes 80 may be sufficiently resilient tocompensate for any variation in elevation of the pads 54 on the uppersurfaces of ICs 56.

Various types of structures can be used to implement probes 80including, for example, wire bond and lithographic spring contacts,needle probes, and cobra probes. Spring contacts may be formed on a pador other base structure of a substrate in any of a number of ways. Asone example, a spring contact may be formed by wire bonding a wire tothe pad and overcoating the wire with a resilient material, such asdisclosed in U.S. Pat. No. 6,336,269 issued Jan. 8, 2002 to Eldridge etal., incorporated herein by reference. As another example, a springcontact may be formed lithographically by depositing material in one ormore molds formed over the pad and substrate. Examples of suchlithographic techniques can be found in U.S. Pat. No. 6,255,126 issuedJul. 3, 2001 to Mathieu et al., and U.S. patent application Ser. No.09/710,539 filed Nov. 9, 2000, both of which are incorporated herein byreference. U.S. patent application Ser. No. 09/746,716 filed Dec. 22,2000 (also incorporated herein by reference) discloses yet anotherexemplary spring contact.

When spring contacts are employed to implement probes 80, they can beformed on the pads 54 of ICs 56 when space transformer 64 includes pads81 on its lower planar surface arranged to contact the tips of thespring contacts. Alternatively, spring contact probes 80 may be formedon the pads 81 on the lower planar surface space transformer 64 andarranged so that their tips contact the pads 54 of ICs 54.

U.S. Pat. No. 6,064,213, issued May 16, 2000 to Khandros et al.(incorporated herein by reference) disclose and example of a cardassembly designed to contact spring contacts formed on an IC. Thefollowing patents, each incorporated herein by reference, describeexamples in which spring contact formed on a probe board assemblyfunction as probes: U.S. Pat. No. 5,974,662 issued Nov. 2, 1999 toEldridge et al.; U.S. patent application Ser. No. 09/810,874 filed Mar.16, 2001; and U.S. Pat. No. 6,218,910 issued Apr. 17, 2001 to Miller.

A test, power or ground signal provided at an I/O port of an IC tester52 travels through one of pogo pins 68 to one of pads 70 on the surfaceof interface board 60, and then travels through traces and vias withininterface board 60 to one of pads 72 on its lower surface. The testsignal then passes through one of spring contacts 74, through a viawithin interposer 62, and through one of spring contacts 76 to one ofpads 78 on the surface of space transformer 64. Traces and vias withinspace transformer 64 then deliver the test signal to one of probes 80which forwards the test signal to one of IC pads 54. An IC output signalgenerated at one of IC pads 54 follows a similar path in an oppositedirection on its way back to an I/O port of a channel within tester 52.

As best seen in FIG. 5, probe system 50 provides a signal path betweenIC tester 52 and IC pads 54 suitable for conveying high frequencysignals, for example up to approximately 100 GHz in frequency. A pogopin connector 84 mounted on a lower edge of a printed circuit boardwithin IC tester 52 provides pogo pins 83 for conveying high frequencysignals between a tester channel I/O port and pads 85 formed on an endof a flex cable 86 linked to conductors within the flex cable. Oppositeends of the conductors within flex cable 86 are terminated on the lowersurface of space transformer 64. Flex cable 86 includes a flexiblesubstrate holding conductors for conveying signals. Various types ofwell-known flex cables may be used to implement flex cable 86. Forexample flex cable 86 may include one or more substrate layers offlexible polyimide, teflon, or other dielectric material upon whichmicrostrip and/or strip-line conductors of copper or other conductivematerial are formed, for example through lithographic techniques, toprovide uniform transmission line environments over the entire length ofthe flex cable. A flex cable 86 may provide parallel pairs of tracesproviding paths for high noise immunity differential signals.

Flex cable 86 may alternatively consist of or include one or morecoaxial cables and may include other types of transmission lines formedon or within the flexible substrate for providing signal paths throughthe flex cable.

While the exemplary embodiments of the invention illustrated in FIGS. 4and 5 employ pogo pin connectors 66 or 84 as signal paths between ICtester 52 and probe board 50, the signal paths between IC tester 52 andprobe board 50 may be implemented in many other ways, such as forexample through coaxial or flex cables or various types of well-knownconnectors such as SMB, SMP or SMA connectors.

As illustrated in FIG. 6, an upper end of flex cable 86 may be encasedin epoxy 90 or other suitable insulating material to form a cabletermination block 92. The top of termination block 92 may be ground to aflat surface to expose ends of the conductors. Conductive materialdeposited on the exposed conductor ends may provide pads 85 forreceiving pogo pins 83. Each termination block 92 is suitably held byadhesive within an opening in interface board 60 with the terminationblock positioned so that the pads 85 on its upper surface reside in sameplane on the upper surface of the interface board as pads 70 (FIG. 4).

FIG. 7 is an upward-directed plan view of the lower surface of spacetransformer 64 upon which four flex cables 86 are terminated. Forsimplicity, space transformer 64 is depicted as having an array of 36probe pads 81 on its under surface upon which probes 80 (FIG. 5) may beformed, though in practice space transformer 64 may include a muchlarger array of pads 81. Exposed lower ends 94 of the conductorsprovided by flex cables 86 are connected (as by solder, wire bonds,conductive adhesive, or other means) to pads 96 on the lower surface ofspace transformer 64. Traces 98 formed on the lower surface of spacetransformer 64 link some of pads 96 to some of probe pads 81. Upwardextending vias (not shown) may link other conductors 94 to traces (notshown) formed on higher layers of space transformer 64. The higher layertraces extend to other vias (not shown) passing downward to other probepads 81.

A signal path between tester 52 and spring contacts 80 provided by pogopins 83 and flex cable 86 of FIG. 5 can have a higher bandwidth than asignal path passing through probe board assembly 51 because most of thehigher bandwidth path consists of a highly uniform transmission lineenvironment having evenly distributed impedance. Also the higherbandwidth path includes substantially fewer junctions between dissimilartransmission lines that can cause signal attenuation and distortion. Asdescribed above, a signal path through pogo pins 66 (FIG. 4), interfaceboard 60, interposer 62 and space transformer 64 may include 10 or moresuch junctions. A signal path though pogo pins 83 (FIG. 5), flex cable86, and traces 96 (FIG. 7) on the lower surface of space transformer 64includes only three transmission line junctions.

FIGS. 8-10 illustrate another example probe system 100 having much incommon with probe system 50 of FIGS. 3-5 and, accordingly, similarreference characters refer to similar structures. However probe system100 differs from probe board assembly 51 not only because it employs twoflex cables 86 instead of four, but also because the lower ends of theconductors within flex cables 86 are coupled to IC pads 54 in a way thatbypasses spring contacts 80.

As illustrated in FIGS. 8-10, flex cable 86 includes serpentinesubstrate fingers 102 containing conductors forming signal pathsextending into the area under space transformer 64 occupied by probes80. Bypassing various probes 80A carrying signals between spacetransformer 64 and various IC pads 54A, each finger 102 extends over oneor more IC pads 54B that are to transmit or receive high frequencysignals via the transmission line(s) included in the finger. Pointedconductive tips 106 formed on the underside of fingers 102 act as probesto provide signal paths between the transmission lines residing withinthe fingers and the high frequency IC pads 54B.

Ends of spring contacts 80B that are somewhat shorter than the springcontacts 80A that carry lower frequency signals to and from IC pads 54Aare bonded to the upper surfaces of flex cable fingers 102 tostructurally link each finger 102 to the under surface of spacetransformer 64. Spring contacts 80B do not carry signals but instead actas flexible structural member for holding fingers 102 in place underspace transformer 64 so that their tips 106, and restricting their rangeof motion relative to the space transformer so that they are properlyaligned with IC pads 54B. Thus the uniform transmission lineenvironments provided by conductors within flex cables 86 extend frompogo pins 83 all the way down to the tips 106 acting as probes tocontact IC pads 54B. Note that the flex cable termination arrangement ofprobe system 100 eliminates probe 80 and signal paths within spacetransformer 64 needed by the cable termination arrangement of probesystem 50 of FIGS. 5-7 and therefor reduces the number of transmissionline junctions in the signal path.

ICs 56 may warm up and expand while they are being tested and therebymay cause IC pads 54 to move vertically and to move apart horizontally.Fingers 102 are flexible so that tips 106 can move vertically asnecessary to allow them to remain in contact with IC pads 54B. Fingers102 preferably extend in a serpentine manner under space transformer 64as illustrated in FIG. 10 to provide them with longitudinal flexibilityto permit tips 54B to move horizontally relative to one another asnecessary to remain in contact with IC pads 54B. Space transformer 64 ispreferably formed of a ceramic or other substrate material having acoefficient of thermal expansion similar to that of the semiconductormaterial forming wafer 58. The temperature of space transformer 64 tendsto track that of wafer 58 since it is positioned very close to thewafer. When space transformer 64 has the same coefficient of thermalexpansion as wafer 58, probes 80 tend to move apart at the same rate asIC pads 54A so that probes 80 remain in contact with IC pads 54A. Sincethe serpentine flex cable fingers 102 have the flexibility to move inthe horizontal plane parallel to the plane of the wafer, and sincespring contacts 80B attached to finger 102 above finger tips 54structurally link fingers 102 to space transformer 64, finger tips 54also move in a vertical direction perpendicular to the plane of thewafer surface as necessary to remain in contact with pads 54B as pads54B move apart with increasing wafer temperature.

FIGS. 11 and 12 illustrate another exemplary embodiment of the inventionemploying an alternative approach for terminating conductors of the flexcables of probe system 100 under space transformer 64. FIG. 11 anupward-directed plan view of the undersides of flex cables 86 havingfingers 120 extending under space transformer 64. FIG. 12 is a partialsectional elevation view of one finger 120 extending between spacetransformer 64 and an IC 56. Fingers 120 extend over the IC pads 54Bthat are to be accessed by conductors within fingers 120. Tips 106 onthe underside of fingers 120 provide signal paths between I/O pads 54Band the conductors within fingers 120. Probes 80B connected betweenfingers 120 and pads 81 on the under surface of space transformer 64 donot carry signals, but instead act only as flexible structural memberssupporting fingers 120 and restricting their range of horizontal motion.

As they extend over pads 54B, fingers 120 may pass over some contacts54C that are to be accessed via spring contacts 80C attached to andextending downward from pads 81 on the underside of space transformer64. Lower ends of spring contacts 80C are attached to upper surfaces ofvias 122 extending vertically though flex cable fingers 120 to tips 124mounted on the under surface of flex cable 86 for contacting IC pads54C. Lower frequency signals may therefore pass between IC pads 54C andpads 81 on the lower surface of space transformer 64 through probes 80C,vias 122 and probe tips 124 while higher frequency signals entering ordeparting IC pads 54B pass through probe tips 106 and conductorsimplemented within flex cable fingers 120. Lower frequency signals mayalso pass between pads 81 and IC pads 54A directly through probes 80A.

FIG. 13 is a sectional elevation view of a probe system 110 inaccordance with another exemplary embodiment of the invention that is avariation on probe system 50 of FIG. 5, wherein similar referencecharacters refer to similar structures. Probe board assembly 110 differsfrom probe board assembly 50 in that upper ends of conductors withinflex cables 86 are terminated on pads 112 formed on the lower surface ofinterface board 60. Traces and vias (not shown) formed on and withininterface board 60 link pads 112 to the pads 85 on the upper surface ofthe interface board contacted by pogo pins 83.

FIG. 14 is a sectional elevation view of a probe system 120 inaccordance with another exemplary embodiment of the invention that is avariation on probe system 100 of FIG. 8, wherein similar referencecharacters refer to similar structures. FIG. 15 is an expanded sectionalelevation view of the portion of the probe system 120 of FIG. 14residing between space transformer 64 and ICs 56, and FIG. 16 is a planview looking upward from of wafer 58 toward the under sides of flexcables 86 and space transformer 64.

Probe system 120 of FIG. 14 differs from probe system 100 in that flexcables 86 extend completely under space transformer 64 as best seen inFIGS. 15 and 16. Probe tips 130 mounted on the lower sides of flexcables 86 contact the IC pads 54. Flexible spring contacts 80 attachedbetween pads 81 on the lower surface of space transformer 64 and to pads132 on the upper surfaces of flex cables 86 above probe tips 130 providesupport for cables 86.

Vias 133 through flex cables 86 may link one set of probe tips 130 tothe pads 132 above the tips. IC tester 52 is therefore able tocommunicate with some IC pads 56 by way of paths extending through probeboard 60, interposer 62, space transformer 64, spring contacts 80, vias133 and probe tips 130.

A second set of probe tips 130 formed on the lower surface of flexcables 86 are connected to the signal paths (not shown) provided by flexcable 86 so that IC tester 52 may also communicate with some of IC pads54 through high frequency signals passing through flex cables 86 andprobe tips 130. The spring contacts 80 above the second set of probetips 130 do not convey signals, but they do provide flexible support forthe probe tips.

FIG. 17 is an enlarged plan view of area of flex cable 86 holding one ofprobe tips 130. Parts of the substrate material of flex cable 86 areremoved to create spaces 134 nearly surrounding an island 138 of flexcable substrate holding probe tip 130. Two (or more) small, flexibleserpentine bridges 140 of flex cable substrate remain to link eachsubstrate island 138 to the main expanse of flex cable 86. For the setof probe tips 138 that communicate with IC tester 52 through signalpaths provided by flex cables 86, those signal paths extend to that setof probe tips 130 through bridges 140.

Bridges 140 and the spring contacts 80 connected to flex cable 86 aboveislands 138 also hold tips 130 in position above the IC pads 54 (FIG.13) they contact. As discussed above, IC pads 54 are not perfectlyco-planar with one another, and they can move both vertically andhorizontally as the ICs under test warm up and expand. Bridges 140 andthe spring contact 80 above each probe tip 130 have sufficientflexibility to allow the probe tip 130 to move vertically as necessaryto remain in contact an IC pad 54 even though the elevation of the padmay change as the IC wafer begins to warm up.

Although the substrate material of flex cable 86 may not have the samecoefficient of thermal expansion as the semiconductor material formingwafer 58 (FIG. 11), the serpentine nature of bridges 140 provides themwith sufficient flexibility to allow probe tips 130 to also movehorizontally relative to one another and relative to the main body offlex cable 86 as necessary to remain in contact with the IC pads 54 whenthe pads move horizontally during thermal expansion of the ICs undertest.

FIG. 18 is a sectional elevation view of a probe system 150 inaccordance with another exemplary embodiment of the invention that is avariation on probe system 110 of FIG. 14, wherein similar referencecharacters refer to similar structures. FIG. 19 is an expanded sectionalelevation view of the portion of the probe system 150 of FIG. 18residing between space transformer 64 and ICs 56, FIG. 20 is a plan viewlooking upward from wafer 58 toward the under sides of flex cables 86and space transformer 64, and FIG. 20 is an enlarged view of a portionof the flex cable 86 of FIG. 20 illustrating a single substrate island138 linked to flex cable 86 thorough substrate bridges 140.

Probe system 150 provides signal paths between IC tester of FIG. 18 andspring contacts 152 that are attached to the pads 54 of ICs 56. Probesystem 150 differs from probe system 110 of FIG. 14 in that in probesystem 150 pads 154 on the upper surface of flex cable substrate islands138 are directly connected by a solder ball array 156 to pads 81 on thelower surface of space transformer 64. Also a pad 158, rather than aprobe tip, is formed on the lower surface of each flex cable substrateisland 138. Pads 158 are positioned so that they may be contacted bytips of the spring contacts 152 extending upward from the IC pads 54.

Vias 133 extending through some of islands 138 link one set of probe pad158 to the pads 154 on the upper surface of the islands. IC tester 52 istherefore able to communicate with some IC pads 56 by way of pathsextending through probe board 60, interposer 62, space transformer 64,solder balls 156 vias 133, pads 158 and spring contacts 152.

A second set of pads 158 formed on the lower surfaces of substrateislands 138 are connected to the signal paths (not shown) provided byflex cable 86 so that IC tester 52 may also communicate with some of ICpads 54 through high frequency signals passing through flex cables 86,substrate bridges 140, pads 158 and spring contacts 152.

FIG. 22A illustrates another exemplary embodiment of the invention, amultiple-layer probe card assembly 160 for providing signal pathsbetween an integrated circuit tester 162 and pads 163 on surfaces of ICdice 164 on a wafer 166 under test. Probe assembly 160 can also provideremote test equipment (not shown) with signal access to IC pads 163.

Probe card assembly 160 includes a probe board 170 having a set of pads172 on its upper surface for receiving tips of a set of pogo pinconnectors 174 providing signal paths between tester 162 and pads 172.Signal paths extending through one or more flex cables 175 interconnecta set of spring contacts 176 and 178 formed on the upper and lowersurfaces of flex cable 175 provide signal paths between a set of pads180 on the lower surface of probe board 170 and a set of pads 182 on anupper surface of a space transformer board 184. A set of probes 186provide signal paths between pads 188 on the lower surface of spacetransformer 184 and IC pads 163. Probe board 170 and space transformer184 may include single or multiple insulating substrate layers, tracesformed on the substrate layers, and vias extending through the substratelayers for conducting signals horizontally and vertically between padsand/or contacts on their upper and lower surfaces.

Some of spring contacts 178 may contact signal paths within flex cables175 that may extend to probe board 170. Probe board 170 links some ofits upper surface contacts 172 to the conductors within the flex cable175, thereby permitting high frequency or other signals traveling viaflex cable 175 to spring contacts 178 and to by-pass transmission linejunctions within probe board 170 and between pads 180 and contacts 176.One or more conductors of flex cableS 175 may extend to remote equipment(not shown) connected anywhere by any means to a rigid substrate.)

FIG. 22B is a block diagram illustrating an exemplary signal routingscheme within flex cable 175. A flex cable includes a flexible substratethat can be used like a circuit board to hold install small surfacemounted devices on a flex cable, including passive devices such asresistors and capacitors and active devices including, for example,integrated circuit switches, multiplexers and the like which can act asignal routing devices. FIG. 22B shows a set of integrated circuitrouting switches 191 powered and controlled by signals from one oftester channels for selectively linking the pads 192 on the lowersurface of flex cable 175 accessed by spring contacts 178 of FIG. 22A tovarious other conductors including spring contacts 176 and flex cableconductors leading to tester 162 or to the remote equipment.

The switching arrangement of FIG. 22B is useful, for example, when ICtester 162 and other remote test equipment carry out different types oftests at the IC terminals. For example IC tester 162 may be adapted tocarry out logic tests on ICs 164 while the remote equipment may beadapted to carry out parametric tests on the ICs. The remote equipmentmay also supply the power for the ICs being tested. Some paths to theremote equipment (such as for example those connected to power supplies)may connect directly to spring contacts 178 so that remote equipment andtester 162 can concurrently access various IC pins during a test. Toincrease the number of ICs that can be concurrently tested, more thenone IC tester of the same type can concurrently access the ICs. This isparticular feasible in low frequency testing applications where it isnot necessary to minimize signal path distances between the testequipment and the ICs being tested. In such case routing switches 191are not needed since each flex cable conductor and each spring contact176 accesses a separate spring contact 179. The flex cables 175 can beeasily replaced with flex cables have different signal routingarrangements to accommodate changes in routing patterns resulting inchanges to the ICs being tested or to accommodate changes in the testequipment.

FIG. 23A is a plan view, of a pair of flex cables 86 passing under arigid substrate 193 looking upward from a wafer 194 (FIG. 23B) beingaccessed via a set of probes 195 attached either to space transform 193or to pads on the surface of wafer 194. Probes 195 pass through a set ofwindows 196 in flex cables 86. FIG. 23B is a sectional elevation viewalong cut line B—B of FIG. 23A. FIGS. 23A and 23B illustrate analternative approach to linking some of probes 156 to conductors 197 inflex cable 86. A set of spring contacts 198 extending between pads onthe upper surface of flex cable 86 linked to conductors 197 through vias199 passing vertically through flex cable 86 and pads 200 on the lowersurface of substrate 193. Conductors (not shown) formed within or on thesurface of space transformer 193 link pads 200 on the lower surface ofsubstrate 193 contacted by or attached to probes 200. This type ofinterconnect arrangement can be employed in lieu of or in addition tothe interconnect arrangements illustrated in FIGS. 7, 10, 11, 15 and 19.

FIGS. 24A-24G illustrate an exemplary process for forming contact tipstructures and attaching them to pads of a flex cable so that the cablesmay be employed in various exemplary embodiments of the inventiondescribed herein above. As illustrated in FIG. 24A, a set of pits 210are suitably formed in a substrate 212 of any suitable material such as,for example, a silicon semiconductor wafer using photolithographicetching or any other suitable technique. A layer 214 of readily etchablereleasing/shorting material, such as for example aluminum, is thenformed over the upper surface of substrate 210 as illustrated in FIG.24B. As illustrated in FIG. 24C masking material 216 such as photoresistis then deposited on the releasing/shorting material 214 to form a setof molds 218 defining shapes of the contact tip structures. Referring toFIG. 24D, conductive material 220 that is to form the contact tipstructures is then deposited in the molds. The tip structure material220 may be deposited by electroplating or any other known process ofdepositing material within a pattern masking material. As illustrated inFIG. 24E, the masking material 216 is then removed to reveal a set oftips 222. As shown in FIG. 24F, the tip structures 222 are then attachedto pads 224 on the flex cable 226 using joining material 228 such as,for example, conductive adhesive, solder, brazing material and the like.The release/shorting layer 218 is then removed, for example by etching,to release the tip structures 230 from substrate 210 shown in FIG. 24G.

Releasing/shorting layer 214 thus not only facilitates the formation oftips 222 though electroplating, it also provides a base for tips 222which can be easily etched to release tips 22 from substrate 210.Releasing/shorting layer 214 may include one or more layers, with areleasing material layer being formed first and a shorting materiallayer being formed on the releasing material layer.

The particular size, shape or contour of tip structure 230 shown in FIG.24G is not critical to the invention and other suitable tip structuresof various sizes and shapes can be formed in a similar manner.Additional exemplary tip structures are disclosed in U.S. patentapplication Ser. No. 08/819,464, filed Mar. 17, 1997, now abandoned, andU.S. patent application Ser. No. 09/189,761, filed Nov. 10, 1998, bothincorporated herein by reference.

The forgoing specification and the drawings depict exemplary embodimentsof the best modes of practicing the invention, and elements of thedepicted best modes exemplify elements of the invention as recited inthe appended claims. It is not intended, however, that the invention belimited to the exemplary embodiments described herein above or to theparticular manner in which the embodiments operate. For example, whileFIGS. 7, 10, 11 and 15 illustrate exemplary embodiments of the inventionemploying two or four flex cables 86, it should be understood that thenumber of flex cables and the number of conductors included in each flexcable can be chosen to suit the requirements of each particular testinterconnect application. While pogo pin connectors 66 or 84 (FIGS. 4,5, 13 or 14) may be used to link flex cables 86 or interface board 60 totester 52, other types of connectors known to those of skill in the artmay be employed. The probe board assemblies illustrated in FIGS. 4, 8,13 and 14 are exemplary and may be implemented using more or fewerinterconnected substrate layers. For example, the interposer 62 shown inFIGS. 5, 8, 13, 14 and 18 may be eliminated and the space transfer 64connected directly to interface board 60. As another example, interposer62 and space transformer 64 of those figures may be eliminated whenprobes 80 are formed directly on interface board 60. Also the suggestedsignal frequency ranges for the various types of signal paths throughthe probe board assembly and flex cable are exemplary and not intendedto be limiting. While the exemplary embodiments of the inventiondescribed above are adapted for linking an IC tester to ICs while stillin the form of die on a semiconductor wafer, it should be understoodthat other embodiments of the invention may be used for linking an ICtester to ICs after they have been separated from one another, forexample when held in an array on a tray.

The appended claims are therefore intended to apply to any mode ofpracticing the invention comprising the combination of elements or stepsas described in any one of the claims, including elements that arefunctional equivalents of the example elements of the exemplaryembodiments of the invention depicted in the specification and drawings.

1. An apparatus for providing signal paths between an integrated circuit(IC) tester and a plurality of IC pads on a surface of an IC to betested, the apparatus comprising: a substantially flexible substrateincluding a first signal path conductively linked to a first point onthe flexible substrate; a conductive first probe for contacting thefirst point on the flexible substrate and for contacting a first IC padof the plurality of IC pads; a rigid substrate including an electricalpath for linking the IC tester to the first signal path of the flexiblesubstrate; and a first structural member for attaching to a second probeon the flexible substrate so as to substantially inhibit freedom ofmovement of the second probe relative to the rigid substrate.
 2. Theapparatus in accordance with claim 1 wherein the first probe comprises aspring contact.
 3. The apparatus in accordance with claim 1 wherein thefirst probe is attached to said first point and includes a tip forcontacting the first IC pad.
 4. The apparatus in accordance with claim 1wherein the first probe is attached to the first IC pad and includes atip for contacting the first point.
 5. The apparatus in accordance withclaim 4 wherein the first probe comprises a spring contact.
 6. Theapparatus in accordance with claim 1 wherein: the second probe extendsbetween the flexible substrate and a second IC pad of the plurality ofIC pads.
 7. The apparatus in accordance with claim 6 wherein the secondprobe comprises a spring contact.
 8. The apparatus in accordance withclaim 6 wherein the first structural member comprises a flexible cablefor conductively linking the second probe to said IC tester.
 9. Theapparatus in accordance with claim 6 wherein the first structural membercomprises means for conductively linking the second probe to the ICtester.
 10. The apparatus in accordance with claim 1 further comprising:a conductive contact extending from the first structural member tocontact a second IC pad of the plurality of IC pads, wherein the firststructural member; conductively links said conductive contact to connectto the IC tester.
 11. The apparatus in accordance with claim 10 furthercomprising means for conductively linking the conductive contact to thesecond probe, wherein the second probe is linked through a conductivepath separate from the structural member to the IC tester, theconductive path provided vertically through the flexible substrate andthrough the rigid substrate.
 12. The apparatus in accordance with claim10 wherein the conductive contact comprises a spring contact.
 13. Theapparatus in accordance with claim 12 wherein the flexible substrate hasopposing surfaces, wherein the third point and the fourth point are onseparate ones of the opposing surfaces, and wherein the means forconductively linking said third and fourth points comprises a viapassing through the flexible substrate between the opposing surfaces.14. The apparatus in accordance with claim 1 wherein said flexiblesubstrate comprises: a flexible substrate expanse having an aperturetherein, a first substrate island residing in the aperture, the firstpoint and the second point residing on said first substrate island, andat least one flexible first substrate bridge linking the first substrateisland to the flexible substrate expanse, said first signal path extendsthrough said at least one first substrate bridge.
 15. The apparatus inaccordance with claim 14 wherein the first probe comprises a flexiblespring contact.
 16. The apparatus in accordance with claim 15 whereinthe first structural member rigidly bonds the second point to the rigidsubstrate.
 17. The apparatus in accordance with claim 14 furthercomprising: a conductive second probe for contacting a third point onthe flexible substrate and for contacting a second IC pad of theplurality of IC pads, said rigid substrate being structurally linked toa fourth point on the flexible substrate proximate to the third point soas to substantially inhibit freedom of movement of the third pointrelative to the rigid substrate, means for conductively linking thethird and fourth points, a second conductive structural member extendingbetween the fourth point and the rigid substrate and substantiallylimiting movement of the fourth point relative to the rigid substrate,and means including a conductor formed on the rigid substrate forproviding a conductive signal path between the second conductivestructural member and the IC tester.
 18. The apparatus in accordancewith claim 17 wherein the flexible substrate expanse has a secondaperture therein and further comprises: a second substrate islandresiding in the second aperture, the third point and the fourth pointresiding on said substrate island, and at least one flexible secondsubstrate bridge linking the second substrate island to the flexiblesubstrate expanse.
 19. The apparatus in accordance with claim 14 whereinthe first structural member comprises a flexible spring contact.
 20. Theapparatus in accordance with claim 19 wherein the first probe comprisesa substantially rigid tip attached to the first point for contacting thefirst IC pad.
 21. The apparatus in accordance with claim 20 wherein thefirst and second structural members comprise flexible spring contacts,and wherein the first and the second probes comprise substantially rigidtips attached to the first and third points, respectively, forcontacting the first and second IC pads, respectively.
 22. The apparatusin accordance with claim 20 wherein the first and second structuralmembers rigidly bond the second and fourth points to the rigidsubstrate, and wherein the first and the second probes comprise flexiblespring contacts.
 23. An apparatus for providing signal paths between anintegrated circuit (IC) tester and a plurality of IC pads on a surfaceof an IC to be tested, the apparatus comprising: a rigid substrate; asubstantially flexible substrate including a conductive first probeextending between the flexible substrate and a first IC pad of theplurality of pads and a first path for connecting to the first probe;and a structural member attached to an end portion of the flexiblesubstrate and to the rigid substrate to substantially inhibit freedom ofmovement of the end portion relative to the rigid substrate, thestructural member providing a conductive link between the first signalpath and the IC tester.
 24. The apparatus in accordance with claim 23wherein the structural member further comprises: a flexible substratefinger attached to the end portion of the flexible substrate on a samesurface of the flexible substrate as the first probe.
 25. The apparatusin accordance with claim 23 wherein the conductive link between thefirst signal path and the first probe comprises a flexible cableattaching the flexible substrate to the rigid substrate.
 26. Theapparatus in accordance with claim 23 further comprising: a conductivesecond probe extending between the rigid substrate and a second IC padof the plurality of IC pads; and means for conductively linking thesecond probe to the IC tester including a conductor passing though therigid substrate.
 27. The apparatus in accordance with claim 23 whereinthe means for conductively linking the first signal path to the firstprobe comprises conductive means extending from the first signal paththrough a point of attachment of the end portion of the flexiblesubstrate and the rigid substrate, and through the rigid substrate tothe first probe.
 28. The apparatus in accordance with claim 27 furthercomprising: a conductive second probe extending between the rigidsubstrate and a second IC pad of the plurality of IC pads; and means forconductively linking the second probe to the IC tester including aconductor passing though the rigid substrate.
 29. The apparatus inaccordance with claim 28 wherein the first probe comprises a flexiblefirst spring contact and the second probe comprises a flexible secondspring contact.
 30. An apparatus for providing signal paths between testequipment and a first integrated circuit (IC) pad and first IC pad on anIC to be tested, the apparatus comprising: a probe board assemblycomprising at least a first substrate layer and a second substrate layerand a first signal path through the probe board assembly, wherein: thefirst substrate layer includes a first contact and a second contact, thefirst contact linking the IC pad to the first signal path, and thesecond contact connecting to a second signal path the second signal pathprovided around at least one of the substrate layers of the probe boardassembly.
 31. The apparatus in accordance with claim 30 wherein thefirst contact comprises a spring contact attached to the probe boardassembly and having a tip for contacting the first IC pad.
 32. Theapparatus in accordance with claim 30 wherein the first contactcomprises a spring contact attached to the first IC pad and having a tipfor contacting the probe board assembly.
 33. The apparatus in accordancewith claim 30 wherein the apparatus further comprises at least oneflexible structural member attached between the first substrate and saidIC to be tested.
 34. The apparatus in accordance with claim 30 whereinsaid at least one substrate layer comprises material having acoefficient of thermal expansion substantially similar to a coefficientof thermal expansion of said at least one IC.
 35. The apparatus inaccordance with claim 30 wherein the probe board assembly furthercomprises an interposer with spring contacts connecting the first andsecond layers, wherein the second signal path is provided around theinterposer, and the first signal path is provided through theinterposer.
 36. The apparatus in accordance with claim 30 wherein saidsecond signal path comprises a coaxial cable.
 37. The apparatus inaccordance with claim 30 wherein the first signal path has a frequencyresponse of a Butterworth filter.
 38. The apparatus in accordance withclaim 30 wherein the first signal path has a frequency response of aChebyshev filter.
 39. The apparatus in accordance with claim 30 whereinthe first signal path comprises a first pogo pin connector linking thefirst contact to the IC test equipment, and wherein the second signalpath comprises a second pogo pin connector linking the second contact tothe IC test equipment.
 40. The apparatus in accordance with claim 30wherein the second contact comprises a conductive tip formed on asurface of the flexible substrate and conductively linked to the secondsignal path.
 41. The apparatus in accordance with claim 30 wherein thesecond signal path conveys a high frequency signal with less noise thanthe first signal path.
 42. The apparatus in accordance with claim 30wherein the first signal path is provided vertically through the firstsubstrate from the first contact, at substantially a right angle to thesecond path as provided from the second contact.
 43. The apparatus inaccordance with claim 30 wherein the first signal path comprises acoaxial conductor.
 44. The apparatus in accordance with claim 30 whereinsaid second signal path has a path impedance substantially uniformlydistributed throughout its length.
 45. The apparatus in accordance withclaim 44 wherein said first signal path provides a path impedance thatis other than substantially uniformly distributed throughout its length.46. The apparatus in accordance with claim 44 wherein the first signalpath comprises a plurality of substantially differing kinds oftransmission lines connected in series, and wherein the plurality oftransmission lines have substantially similar characteristicsimpedances.
 47. The apparatus in accordance with claim 30 wherein saidat least one substrate layer comprises: an interface board forming thesecond substrate layer having a surface defining a first plane; a spacetransformer forming the first substrate layer having a surface defininga second plane; an interposer substrate layer residing between theinterface board substrate layer and the space transformer substratelayer, and wherein said first signal path extends through said first andsecond planes and includes vias extending within each substrate layerand at least one conductive trace formed on or within at least one ofthe substrate layers.
 48. The apparatus in accordance with claim 47wherein the interface board, space transformer and interposer substratelayers are spaced apart and wherein said first signal paths furthercomprise spring contacts extending between the interface board andinterposer substrate layers and between the interposer and spacetransformer substrate layers.
 49. The apparatus in accordance with claim47 wherein the interface board substrate layer includes an aperture, andwherein the space transformer substrate includes an end having aconductive element attached, the conductive element extending from thefirst substrate through the aperture.
 50. The apparatus in accordancewith claim 49 wherein the interface board substrate further comprises: apogo pin connector providing a pogo pin contacting the second signalpath on the end of the flexible substrate extending through theaperture, for conductively linking said second signal path to the testequipment.
 51. The apparatus in accordance with claim 47 wherein thesecond signal path terminates on the interface board substrate layer,and wherein the second means comprises: a conductive pad formed on theinterface board layer and residing in the first plane, and a conductivepath passing through the interface board layer and linking theconductive pad to the second signal path.
 52. The apparatus inaccordance with claim 51 wherein the second means further comprises apogo pin connector for linking the conductive pad to the IC testequipment.